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HAD203
    发布时间: 2019-07-13 16:08    

HAD203(平面式高速固晶机)

(周期:65ms

适用于印刷锡膏后的贴片二极管、三极管、光耦、手机背光源

一、机型特性

1.采用国际领先的双固晶,双晶片搜寻系统;

2.采用直驱电机驱动邦头;

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C);

4. 晶框采用自动角度修正系统;

5.采用真空漏晶检测;

6. 采用自动上下料系统,减少换料时间;

7. 采用自动装卸晶环系统,有效提高了生产效率;

8. 工控机控制设备运行,简化了自动化设备的操作;

9.精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

HAD203

Cycle: 65ms

Plane-type High-speed Die Bonder

It is compatible with solder paste printed SMD diodeaudionoptocoupler tube and mobile-phone backlight etc.


Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system is applied to saving the time of reloading;

7.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4.图像识别系统/Image Recognition System

生产周期/Production Cycle

145ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

灰阶度/Grey Scale

256级灰度Level Grey

芯片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

分辨率/Resolution

512x512像素(Pixel)

通用垂直引线框架尺寸/General Vertical Lead Framework Dimensions

/L

150mm-230mm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

/T

19mm-40mm

(可根据特殊尺寸设计)

(Customizable)

5.系统精准度/ System Accuracy

XY位置精度/Accuracy

±1.5mil(±0.038mm

芯片旋转/Die Rotation

±3°

/H

0.3mm-0.6mm

6.焊头/Welding head

莭距/Pitch

4.5mm-15.5mm

吸晶摆臂/Swing Arm of Die Bonder

90°旋转焊臂(Rotatable Welding Arm)

最多可容纳物料/Materials Held at Most

4K-5K

吸晶压力/Die Bond Pressure

可调20g -250g(Adjustable)

2. 芯片处理器/Die Processor

7.所需设施/Facilities Needed

最大芯片环尺寸/Max. Die Ring Size

6.5(165mm)外径(External Diameter)

电压/频率Voltage/Frequency

220V AC ±5% / 50HZ

压缩空气/Compressed Air

0.5MPaMIN

最大芯片面积尺寸/Max. Die Area

4.7(119mm)扩张后(Expanded)

额定功率/Rated Power

700W

3.芯片工作台/Die XY Workbench

耗气量/Gas Consumption

5L/min

8.体积及重量/Volume and Weight

分辨率/Resolution Ratio

0.04mil(1μm)

xx/

Length x Width x Height

90x95x180cm

顶针Z高度行程/Thimble Z Height Stroke

80mil(2mm)

重量/Weight

515kg


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