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GT100BH-N
    发布时间: 2019-06-24 15:50    


GT100BH-N(平面式高速固晶机)

(周期:50ms)
适用于SMD020,1010,2121,2835,灯丝,COB等

一、机型特性
1.采用国际领先的双固晶,双点胶,双晶片搜寻系统;

2.采用直驱电机驱动邦头
3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C)
4.采用可程式恒温点胶系统;
5.采用真空漏晶检测;
6.采用自动式上下料系统,减少换料时间;
7. 工控机控制设备运行,简化了自动化设备的操作;
8.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;
9. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

GT100BH-N
Plane-type High-speed Die Bonder

Cycle: 50ms
It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.

Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Automatic loading and unloading system is applied to saving the time of reloading;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期

/Production Cycle

50ms

周期取决于晶片尺寸及支架(Depending On Die Size And Holder)

吸晶摆臂

/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调20g250g

(Adjustable)

芯片旋转

/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

170mm*75mm

芯片尺寸

/Die Dimensions

3mil×3mil-80mil×80mil
(0.076mm*0.076mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil(0.5μm)

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max.Angle Correction

±15°(选配)(Optional)

支架长度/Length

120mm ~ 170mm(低于120-80需定制)(Need customize if lower than 120-80mm)

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

支架宽度/Width

40mm~ 75mm(低于40-30需定制)(Need customize if lower than 40-30mm)

最大芯片面积尺寸/Max. Die Area

4.7″(119mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率

/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

950W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/Length x Width x Height

135×89×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1120kg

 





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