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HAD205-PDCO
    发布时间: 2019-06-30 16:55    


HAD205-P支架刷胶机)


(周期:60ms

适用于贴片光耦

一、机型特性

刷胶工艺对胶量一致性/焊层viod控制较点胶和沾胶有明显的优越性

坚固厚重的机构/网板座的可微调整设计,保证平台和网板的相对水平

数据处理能力:;

1,锡膏点位置/大小实时检测表格显示,位置/大小超出上下限报警停机

2,锡膏点位置/大小数据保存可追踪查询;

3,锡膏点位置/大小数据统计功能,如cpk

4,锡膏点位置/大小数据检测结果生成mappingdie attaching使用。

HAD205-P

Screen Printing Machine

Cycle: 60ms

It is compatible with SMD optocoupler etc.

 

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

 

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function, such as cpk.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

25-30s/ 1pcs 支架/holder

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

500W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

139×85×180cm

重量/Weight

800kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

656×492像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

 

HAD205-D平面式双头高速固晶机)



(周期:60ms

适用于印刷锡膏后的贴片光耦

一、机型特性

1.采用国际领先的双固晶,双晶片搜寻系统;

2.采用直驱电机驱动邦头

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C

4. 晶框采用自动角度修正系统;

5.采用真空漏晶检测;

6. 采用自动式上下晶环、自动接驳台结构,有效提高了生产效率;

7. 工控机控制设备运行,简化了自动化设备的操作;

8.精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

9. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障

HAD205-D

Plane-type High-speed Die Bonder

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/

Swing Arm of Die Bonder

双摆臂126°可旋转固晶(Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)

±1mil(±0.025mm

吸晶压力/

Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±1°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/

Range of Stroke

100mm*300mm

芯片尺寸/

Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2.0mm*2.0mm)

XY分辨率/

XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

360°

支架长度/Length

150mm ~ 300mm

最大芯片环尺寸/

Max. Die Ring Size

6″与7″可选(Optional)

支架宽度/Width

50mm~ 100mm

最大芯片面积尺寸/Max. Die Area

4″(101mm)、5″(127mm

7.所需设施/Facilities Needed

分辨率/

Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/

Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

3.图像识别系统/Image Recognition System

耗气量/

Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

192×85×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1250kg

 

HAD205-C(铜片裁切装配机


(周期:60ms

适用于印刷锡膏后的贴片光耦

一、机型特性

1Die dispensing

稳固的机构设计;点胶模组可扩展性适应客户支架;高达4组点胶针头,大大提高了点胶效率,每组点胶机构X/Y/Z向可调整方便调试维护;

2Clip attaching

高精密度冲切模具可保证切口毛刺小于0.05mm;刀具寿命可达2kk次;clip bond force参数化设定可保证芯片不受损

数据处理能力:

a,点胶点和Clip安装点位置/大小实时检测表格显示,位置/大小超出上下限报警停机

b,点胶点和Clip安装点位置/大小数据保存可追踪查询

c,点胶点和Clip安装点位置/大小数据统计功能,如cpk

d,点胶点和Clip安装点位置/大小数据检测结果生成mappingdie attaching使用

 

HAD205-C

Clip and Cutting Machine

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 2kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

 

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

150×95×180cm

重量/Weight

1000kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

656×492像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

 

HAD205-O(支架烘烤机


(周期:60ms

适用于印刷锡膏后的贴片光耦

一、机型特性

1.產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)

2.低耗電(升温时26KW/保温时2KW);低耗氣(100/)

3.無氧化焊接 (氮氣或氮氫混合氣),含氧量20ppm以下

4.同一溫區 溫差小於5?C

5.可程式化之溫度曲線設定

6.即時溫度監控

7.不卡料之料片傳送機構

二、优越性:

1.油烟处理 : 静电式油烟收集方式,回流焊接时产生之废气经处理后可直排室内

2.炉内腔体清洁保养周期 : 依锡膏品质/成份不同而异,如indium免清洗锡膏可一周清洁一次炉内腔体

3.自动profile功能:系统可自动产生炉温曲线,并可保存查询

4.炉盖加热:炉盖备有加热功能,保证焊油不在炉盖上凝聚

5.加热棒:选用高品质加热棒,保证同一温区各点实测最高温减最低温小于或等于5

 

HAD205-O

Reflow Oven

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5 ?C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 5.

三、规格参数:

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

380V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

32000W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

210×120×150cm

重量/Weight

1200kg

6.温度/Temperature

范围/Range

0400

7.水流量及水温/Water Flow and Temperature

水流量/Water Flow

5L / Min

水溫/Water Temperature

15~20?C

8.适用气体 Suitable Gas

N2/H2=93%/7% or N2 only

 

 


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