HAD205-P（支架刷胶机）

（周期：60ms）

适用于贴片光耦等

一、机型特性

刷胶工艺对胶量一致性/焊层viod控制较点胶和沾胶有明显的优越性

坚固厚重的机构/网板座的可微调整设计，保证平台和网板的相对水平

数据处理能力：；

1，锡膏点位置/大小实时检测表格显示，位置/大小超出上下限报警停机

2，锡膏点位置/大小数据保存可追踪查询；

3，锡膏点位置/大小数据统计功能，如cpk ；

4，锡膏点位置/大小数据检测结果生成mapping供die attaching使用。

HAD205-P

Screen Printing Machine

Cycle: 60ms

It is compatible with SMD optocoupler etc.

 

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

 

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function, such as cpk.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function
生产周期/Production Cycle	60ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder) （25-30s/ 1pcs 支架/holder）
2.送料工作平台/Loading Workbench
行程范围/Range of Stroke	100mm*300mm
3.适用支架尺寸/Suitable Holder’s Size
支架长度/Length	150mm~ 300mm
支架宽度/Width	50mm~ 100mm
4.所需设施/Facilities Needed
电压/频率/Voltage/Frequency	220V AC±5%/50HZ
压缩空气/Compressed Air	0.5MPa（MIN）
额定功率/Rated Power	500W
耗气量/Gas Consumption	5L/min
5.体积及重量/Volume and Weight
长x宽x高/Length x Width x Height	139×85×180cm
重量/Weight	800kg
6.图像识别系统/Image Recognition System
灰阶度/Grey Scale	256级灰度(Level Grey)
分辨率/Resolution	656×492像素(Pixels)
图像识别精准度/Image Recognition Accuracy	±0.025mil@50mil观测范围(Observation Range)

 

HAD205-D（平面式双头高速固晶机）

（周期：60ms）

适用于印刷锡膏后的贴片光耦等

一、机型特性

1.采用国际领先的双固晶，双晶片搜寻系统；

2.采用直驱电机驱动邦头

3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）

4. 晶框采用自动角度修正系统；

5.采用真空漏晶检测；

6. 采用自动式上下晶环、自动接驳台结构，有效提高了生产效率；

7. 工控机控制设备运行，简化了自动化设备的操作；

8.精准的设备化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

9. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障

HAD205-D

Plane-type High-speed Die Bonder

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

二、规格参数

Specifications and Parameters

1.系统功能/System Function		4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle	60ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)	吸晶摆臂/ Swing Arm of Die Bonder	双摆臂126°可旋转固晶(Rotatable Die Bond with Double Swing Arms)
XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)	±1mil(±0.025mm）	吸晶压力/ Die Bond Pressure	可调20g—250g(Adjustable)
芯片旋转/Die Rotation	±1°	5.送料工作平台/Loading Workbench
2.芯片XY工作台/Die XY Workbench		行程范围/ Range of Stroke	100mm*300mm
芯片尺寸/ Die Dimensions	5mil×5mil-80mil×80mil (0.13mm*0.13mm-2.0mm*2.0mm)	XY分辨率/ XY Resolution	0.02mil（0.5μm）
		6.适用支架尺寸/Suitable Holder’s Size
晶片最大角度修正/Max. Angle Correction	360°	支架长度/Length	150mm ~ 300mm
最大芯片环尺寸/ Max. Die Ring Size	6″与7″可选(Optional)	支架宽度/Width	50mm~ 100mm
最大芯片面积尺寸/Max. Die Area	4″（101mm）、5″（127mm）	7.所需设施/Facilities Needed
分辨率/ Resolution Ratio	0.04mil  (1μm)	电压/频率/Voltage/Frequency	220V AC±5%/50HZ
顶针Z高度行程/Thimble Z Height Stroke	80mil（2mm）	压缩空气/ Compressed Air	0.5MPa（MIN）
		额定功率/Rated Power	1000W
3.图像识别系统/Image Recognition System		耗气量/ Gas Consumption	5L/min
灰阶度/Grey Scale	256级灰度(Level Grey)	8.体积及重量/Volume and Weight
分辨率/Resolution	656×492像素(Pixels)	长x宽x高/ Length x Width x Height	192×85×180cm
图像识别精准度/Image Recognition Accuracy	±0.025mil@50mil观测范围(Observation Range)	重量/Weight	1250kg

 

HAD205-C（铜片裁切装配机）

（周期：60ms）

适用于印刷锡膏后的贴片光耦等

一、机型特性

1，Die dispensing

稳固的机构设计；点胶模组可扩展性适应客户支架；高达4组点胶针头，大大提高了点胶效率，每组点胶机构X/Y/Z向可调整方便调试维护；

2，Clip attaching

高精密度冲切模具可保证切口毛刺小于0.05mm；刀具寿命可达2kk次；clip bond force参数化设定可保证芯片不受损

数据处理能力：

a，点胶点和Clip安装点位置/大小实时检测表格显示，位置/大小超出上下限报警停机

b，点胶点和Clip安装点位置/大小数据保存可追踪查询

c，点胶点和Clip安装点位置/大小数据统计功能，如cpk

d，点胶点和Clip安装点位置/大小数据检测结果生成mapping供die attaching使用

 

HAD205-C

Clip and Cutting Machine

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 2kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

 

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function
生产周期/Production Cycle	60ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
2.送料工作平台/Loading Workbench
行程范围/Range of Stroke	100mm*300mm
3.适用支架尺寸/Suitable Holder’s Size
支架长度/Length	150mm ~ 300mm
支架宽度/Width	50mm~ 100mm
4.所需设施/Facilities Needed
电压/频率/Voltage/Frequency	220V AC±5%/50HZ
压缩空气/Compressed Air	0.5MPa（MIN）
额定功率/Rated Power	1000W
耗气量/Gas Consumption	5L/min
5.体积及重量/Volume and Weight
长x宽x高/Length x Width x Height	150×95×180cm
重量/Weight	1000kg
6.图像识别系统/Image Recognition System
灰阶度/Grey Scale	256级灰度(Level Grey)
分辨率/Resolution	656×492像素(Pixels)
图像识别精准度/Image Recognition Accuracy	±0.025mil@50mil观测范围(Observation Range)

 

HAD205-O（支架烘烤机）

（周期：60ms）

适用于印刷锡膏后的贴片光耦等

一、机型特性

1.產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)

2.低耗電（升温时26KW/保温时2KW）；低耗氣(100升/分)

3.無氧化焊接 (氮氣或氮氫混合氣)，含氧量20ppm以下

4.同一溫區 溫差小於5?C

5.可程式化之溫度曲線設定

6.即時溫度監控

7.不卡料之料片傳送機構

二、优越性：

1.油烟处理 : 静电式油烟收集方式，回流焊接时产生之废气经处理后可直排室内

2.炉内腔体清洁保养周期 : 依锡膏品质/成份不同而异，如indium免清洗锡膏可一周清洁一次炉内腔体

3.自动profile功能：系统可自动产生炉温曲线，并可保存查询

4.炉盖加热：炉盖备有加热功能，保证焊油不在炉盖上凝聚

5.加热棒：选用高品质加热棒，保证同一温区各点实测最高温减最低温小于或等于5℃

 

HAD205-O

Reflow Oven

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5 ?C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 5℃.

三、规格参数：

Specifications and Parameters

 

1.系统功能/System Function
生产周期/Production Cycle	60ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
2.送料工作平台/Loading Workbench
行程范围/Range of Stroke	100mm*300mm
3.适用支架尺寸/Suitable Holder’s Size
支架长度/Length	150mm ~ 300mm
支架宽度/Width	50mm~ 100mm
4.所需设施/Facilities Needed
电压/频率/Voltage/Frequency	380V AC±5%/50HZ
压缩空气/Compressed Air	0.5MPa（MIN）
额定功率/Rated Power	32000W
耗气量/Gas Consumption	5L/min
5.体积及重量/Volume and Weight
长x宽x高/Length x Width x Height	210×120×150cm
重量/Weight	1200kg
6.温度/Temperature
范围/Range	0～400℃
7.水流量及水温/Water Flow and Temperature
水流量/Water Flow	5L / Min
水溫/Water Temperature	15~20?C
8.适用气体 Suitable Gas
N2/H2=93%/7% or N2 only