HAD308（平面式高速固晶机）
（周期：80ms）
适用于普通贴片，COB, 二极管，三极管，倒装支架等
一、机型特性
1.采用国际领先的双固晶，双点胶，双晶片搜寻系统；
2.采用直驱电机驱动邦头
3.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）
4. 晶框采用自动角度修正系统；
5.采用可程式恒温点胶系统；
6.采用真空漏晶检测；
7.采用免装料盒上料方式，具备吸纸功能（能够剔除框架隔离纸），有效提高了生产效率；
8.工控机控制设备运行，简化了自动化设备的操作；
9.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障
HAD308
Plane-type
High-speed Die Bonder
Cycle: 80ms
It is compatible
with SMD、COB 、diode、audion、flip-chip etc.
1. International leading double die bond, double adhesive dispensing and
double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied
5. Programmed control constant-temperature adhesive dispensing system is also
applied;
6. Vacuum die missing testing technology is adopted;
7. Loading by free-loading magazine with paper suction function (eliminate the
frame release paper), to largely improve the production efficiency;
8. IPC will control the operation of equipment, simplifying the operation of
automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance the enterprise’s competitiveness;
10. Precise die bond location and
excellent compatibility will guarantee the back-end processing.
二、规格参数
Specifications and Parameters
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1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
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生产周期/Production Cycle |
220ms（取决于芯片与支架）(Depending On Die Size And Holder) |
吸晶摆臂 /Die Bonder’s Swing Arm |
150mm 直线电机往复固/linear motor reciprocate die bonding |
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XY位置精度/Accuracy |
±0.6mil(±0.015mm） |
吸晶压力 /Die Bond Pressure |
可调20g—250g(Adjustable) |
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不作上视式检查Accuracy (Up-look inspection) |
±1mil（±0.025mm） |
5.适用支架尺寸/Suitable Holder’s Size |
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芯片旋转/Die Rotation |
±1° |
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2.芯片XY工作台/Die XY Workbench |
支架长度/Length |
110mm ~ 280mm |
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芯片尺寸/Die Dimensions |
5mil×5mil-100mil×100mil 小于12mil芯片需考虑胶杯沾胶 (Consider the glue disk dispensing way if the die is lesser than 12mil) |
支架宽度/Width |
25mm ~ 110mm |
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晶片最大角度修正/ Max. Angle Correction |
360° |
6.所需设施/Facilities Needed |
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适用芯片环尺寸/ Max. Die Ring Size |
外径(External Diameter):296mm 内径(Inner Diameter)：254mm |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
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最大芯片面积尺寸 /Max. Die Area |
直径205mm（扩张后）(Expanded) |
压缩空气/Compressed Air |
0.5MPa（MIN） |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
额定功率/Rated Power |
1820W |
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顶针Z高度行程/Thimble Z Height
Stroke |
80mil（2mm） |
耗气量/Gas Consumption |
5L/min |
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适用铁环/晶圆 Suitable Iron ring/ wafer |
标配 10寸铁环8寸晶圆/Standard Equipped with 10″Iron Ring and 8″Wafer |
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可兼容 8寸铁环6寸晶圆/Compatible with 8″Iron Ring and 6″Wafer |
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3.图像识别系统/Image Recognition System |
适用针筒规格 Suitable Barrel Spec. |
标配10CC(可兼容5CC和3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC) |
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灰阶度/Grey Scale |
256级灰度(Level Grey) |
7.体积及重量/Volume and Weight |
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分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/ Length x Width x Height |
205×135×190cm |
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图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
1800kg |
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