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GT100AH-PA
    发布时间: 2019-06-24 17:05    


GT100AH-PA(平面式高速固晶机)
(周期:50ms

适用于2121,30142835,5050

一、机型特性

1.采用国际领先的双固晶,双点胶,双晶片搜寻系统;

2.采用直驱电机驱动邦头;

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C

4.晶框采用自动角度修正系统;

5.采用可程式恒温点胶系统;

6.采用真空漏晶检测;

7.采用自动式装卸晶环系统、支架采用叠片式上料(免装料盒),有效提高了生产效率;

8.工控机控制设备运行,简化了自动化设备的操作;

9.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

10.精准的固晶位置及优良的一致性为后道工序提供了先天的保障。

 

GT100AH-PA

Plane-type High-speed Die Bonder

Cycle: 50ms

It is compatible with 212130142835 and 5050 etc.

 

Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Automatic installing & uninstalling crystal rings and stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

50ms

周期取决于晶片尺寸及支架(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±1°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

170mm*75mm

芯片尺寸/Die Dimensions

3mil×3mil-80mil×80mil
(0.076mm*0.076mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil(0.5μm)

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max.Angle Correction

±15°

支架长度/Length

120mm ~ 170mm

最大芯片环尺寸/Max.Die Ring Size

6″(152mm)外径(External Diameter)

支架宽度/Width

48mm~ 75mm

最大芯片面积尺寸/Max.Die Area

4.7″(119mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

950W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/Length x Width x Height

170×100×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1200kg

 

 

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