HAD810（全自动平面固晶机）
（周期： 220ms）
适用于IC类框架
一、机型特性
1.直线电机驱动的双点胶系统；
2.高精度直线驱动固晶绑头,音圈扭力环精确控制固晶压力；
3.高精度搜寻芯片平台，伺服电机驱动芯片角度矫正系统，配备自动扩膜系统；
4.采用点胶独立控制系统，胶量控制更加精确；
5.采用真空漏晶检测；
6.工控机控制设备运行，简化了自动化设备的操作；
7.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
HAD810
Automatic Plane-type Die Bonder
Cycle: 220ms
It is compatible with IC frame
1. Linear motor is applied to drive double adhesive dispensing bond head;
2. High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;
3. High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;
4. A separate dispensing control system is adopted to make a precisely control of dispensing amount;
5. Vacuum die missing testing technology is adopted;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance your enterprise’s competitiveness.
二、规格参数
Specifications and Parameters
|
1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
|||
|
生产周期/Production Cycle |
220ms（取决于芯片与支架）(Depending On Die Size And Holder) |
吸晶摆臂 /Die Bonder’s Swing Arm |
150mm 直线电机往复固/linear motor reciprocate die bonding |
|
|
XY位置精度/Accuracy |
±0.6mil(±0.015mm） |
吸晶压力 /Die Bond Pressure |
可调20g—250g(Adjustable) |
|
|
不作上视式检查Accuracy (Up-look inspection) |
±1mil（±0.025mm） |
5.适用支架尺寸/Suitable Holder’s Size |
||
|
芯片旋转/Die Rotation |
±1° |
|||
|
2.芯片XY工作台/Die XY Workbench |
支架长度/Length |
110mm ~ 280mm |
||
|
芯片尺寸/Die Dimensions |
5mil×5mil-100mil×100mil 小于12mil芯片需考虑胶杯沾胶 (Consider the glue disk dispensing way if the die is lesser than 12mil) |
支架宽度/Width |
25mm ~ 110mm |
|
|
晶片最大角度修正/ Max. Angle Correction |
360° |
6.所需设施/Facilities Needed |
||
|
适用芯片环尺寸/ Max. Die Ring Size |
外径(External Diameter):296mm 内径(Inner Diameter)：254mm |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
|
|
最大芯片面积尺寸 /Max. Die Area |
直径205mm（扩张后）(Expanded) |
压缩空气/Compressed Air |
0.5MPa（MIN） |
|
|
分辨率/Resolution Ratio |
0.04mil (1μm) |
额定功率/Rated Power |
1820W |
|
|
顶针Z高度行程/Thimble Z Height
Stroke |
80mil（2mm） |
耗气量/Gas Consumption |
5L/min |
|
|
适用铁环/晶圆 Suitable Iron ring/ wafer |
标配 10寸铁环8寸晶圆/Standard Equipped with 10″Iron Ring and 8″Wafer |
|||
|
可兼容 8寸铁环6寸晶圆/Compatible with 8″Iron Ring and 6″Wafer |
||||
|
3.图像识别系统/Image Recognition System |
适用针筒规格 Suitable Barrel Spec. |
标配10CC(可兼容5CC和3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC) |
||
|
灰阶度/Grey Scale |
256级灰度(Level Grey) |
7.体积及重量/Volume and Weight |
||
|
分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/ Length x Width x Height |
205×135×190cm |
|
|
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
1800kg |
|